无线版本 WiFi6 & ZigBee & BLE 5.3
传输功率 18.0dBm @ 11ax MCS9
接收灵敏度 -70dBm @ 11ax MCS9
天线 Embedded PCB Antenna
供电 2.97-3.63V
重量 1.2g
尺寸 13.6*20.1*2.1mm
功耗 18.0dBm @ 11ax MCS9
GPIO 29
模块简介模块参数

   Powered by Qualcomm high performance 1x1 2.4GHz Wi-Fi 6/BT/15.4 combo multimedia SoC QCC744, Qualcomm QCC744 IoT connectivity LGA module portfolio (“MQM623-1”) is purposely-designed to pack processing capabilities, Wi-Fi/BT/15.4 combo connectivity, and on-module memory into a single 44-pin LGA form factor with flexible choices of Pin,

PCB and U.FL antenna. All variant antenna

modules are pin compatible, allowing easy swap among modules. Its 1.27mm (0.05”) pitch design enables seamless LGA pad into standard 1.27mm (0.05”) header conversion to allow field repalceable header module portfolio if needed.

Unlike other Wi-Fi/BT/15.4 combo modules on the market, MQM623-1 has integrated powerful 325MHz 32- bit RISC-V processor with FPU and DSP, on-chip 484KB SRAM and 128KB ROM, optional 4/8MB pSRAM and 8/16MB flash System-in-Package (SiP), multimedia features such as audio and video codec and interfaces, and 35x multiplexed GPIO rich peripherals. Its all-in-one design and capability contribute to reduced costs and enhanced performance, making it an attractive choice for IoT edge devices requiring single chip solution.

MQM623-1 operates in hostless mode, capable of running both the protocol stack all the way to application level as well as IoT applications without requiring an external MCU. Built on FreeRTOS, Its software SDK will be open-sourced on GitHub coupled with VS Code IDE market extension to facilitate rapid IoT application development. It can also be used as an IoT connectivity transceiver in hosted mode with an external host running all upper protocol stacks and applications.

MAM623-1 has undergone rigorous regulatory compliance testing and is certified with FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC and environmentally compliant with RoHS and WEEE directives. It also completes protocol certification such as Wi-Fi Alliance, Bluetooth SIG 5.3 and OpenThread 1.3, Matter over Wi-Fi and Thread, AWS qualified device.


ITEM

SPECIFICATION

Microcontroller

- 325MHz 32-bit RISC-V processor

On-chip Memory

- 640KB SRAM

- 128KB ROM

-

1/2/4KB OTP

- 4Kb eFuse

Security System

- Security System encryption engine

- Secure services (boot, debug, OTA, OTFAD, etc.)

Wi-Fi Standard

-

802.11b/g/n/ax

-

IEEE 802.15.4

- Bluetooth Classis/Low Energy 5.3 dual mode

Wi-Fi

- Max Tx Power (HT40 and MCS9): +16 dBm

- Active Tx Power (HT40 and MCS9): TBD

- Rx Sensitivity (HT40 and MCS9): -67 dBm

- Active Rx Power (HT20 and MCS3): TBD

802.15.4

- Max Tx Power: TBD


- Rx Sensitivity: TBD


Bluetooth

- Max Tx Power

EDR (3Mbps): +8 dBm

EDR (2Mbps): +10 dBm

BR (1Mbps): +10 dBm

BLE (2Mbps): +10 dBm

BLE (1Mbps): +10 dBm

BLE Coded PHY (500kb

BLE Coded PHY (125kb

- Active Tx Power: TBD

ps): +10 dBm

ps): +10 dBm

- Rx Sensitivity

EDR (3Mbps): -90 dBm

EDR (2Mbps): -96 dBm

BR (1Mbps): -90 dBm

BLE (2Mbps): -99 dBm

BLE (1Mbps): -97 dBm

BLE Coded PHY (500kbps): -102 dBm

BLE Coded PHY (125kbps): -105 dBm

- Active Rx Power: TBD

Peripherals

35x configurable I/O:




- 2x Serial Flash

- SPI

- RMI (10/100M)

- 12x 12-bit ADC

- SD/MMC

- -2x I2C

- CAN bus (ISO11898)

- 2x 12-bit DAC

- SDIO 2.0

- 2x UART

- MIPI-DBI

- 4x PWM

- QSPI

- I2S

- DVP

- JTAG

Voltage

- Input voltage: 2.1V~5.5V


- I/O voltage:1.8V/3.3V

Compliance

- FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC

- WEEE, RoHS

- Bluetooth 5.3, OpenThread 1.3, ZigBee Pro 3.0

- Wi-Fi Alliance, Matter, AWS qualified device

Environmental

- Temperature

Operating: -40°C ~ 10

Storage: -40°C ~ 85°C

5°C

- Humidity

Relative: < 90%

Storage: < 90%

Non-condensing Non-condensing

Physical

- Dimension: 13.6 x 16.1/20.1 x 2.1 mm

- Pin: 44 LGA pad

- Weight: TBD

- Antenna: Pin or PCB or U.FL