Powered by Qualcomm high performance 1x1 2.4GHz Wi-Fi 6/BT/15.4 combo multimedia SoC QCC743, Qualcomm QCC743 IoT connectivity LGA module portfolio (“MQM622-1”) is purposely-designed to pack processing capabilities, Wi-Fi/BT/15.4 combo connectivity, and on-module memory into a single 36-pin LGA form factor with flexible choices of Pin, PCB and
U.FL antenna. All variant antenna modules are pin compatible, allowing easy swap among modules. Its 1.27mm (0.05”) pitch design enables seamless LGA pad into standard 1.27mm (0.05”) header conversion to allow field replaceable header module portfolio if needed.
Unlike other Wi-Fi/BT/15.4 combo modules on the market, MQM622-1 has integrated powerful 325MHz 32- bit RISC-V processor with FPU and DSP, on-chip 484KB SRAM and 128KB ROM. Its all-in-one design and capability contribute to reduced costs and enhanced performance, making it an attractive choice for IoT edge devices requiring single chip solution.
MQM622-1 can operate in hostless mode, capable of running both the protocol stack all the way to applicaiotn level as well as IoT applications without requiring an external MCU. Built on FreeRTOS, Its software SDK will be open-sourced on GitHub coupled with VS Code IDE market extension to faciliate rapid IoT application development. It can also be used as an IoT connecitvity transceiver in hosted mode with an external host running all upper procotcol stacks and applications.
MQM622-1 has undergone rigorous regulatory compliance testing and is certified with FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC and environmentally compliant with RoHS and WEEE directives. It also completes protocol certification such as Wi-Fi Alliance, Bluetooth SIG 5.3 and OpenThread 1.3, Matter over Wi-Fi and Thread, AWS qualified device.
ITEM | SPECIFICATION | ||||||
Microcontroller | - 325MHz 32-bit RISC-V processor | ||||||
On-chip Memory | - 640KB SRAM | - 128KB ROM | - | 1/2/4KB OTP | - 4Kb eFuse | ||
Security System | - Security System encryption engine | - Secure services (boot, debug, OTA, OTFAD, etc.) | |||||
Wi-Fi Standard | - | 802.11b/g/n/ax | - | IEEE 802.15.4 | - Bluetooth Classis/Low Energy 5.3 dual mode | ||
Wi-Fi | - Max Tx Power (HT40 and MCS9): +16 dBm - Active Tx Power (HT40 and MCS9): TBD | - Rx Sensitivity (HT40 and MCS9): -67 dBm - Active Rx Power (HT20 and MCS3): TBD | |||||
802.15.4 | - Max Tx Power: TBD | - Rx Sensitivity: TBD | |||||
Bluetooth | - Max Tx Power • EDR (3Mbps): +8 dBm • EDR (2Mbps): +10 dBm • BR (1Mbps): +10 dBm • BLE (2Mbps): +10 dBm • BLE (1Mbps): +10 dBm • BLE Coded PHY (500kb • BLE Coded PHY (125kb - Active Tx Power: TBD |
ps): +10 dBm ps): +10 dBm | - Rx Sensitivity • EDR (3Mbps): -90 dBm • EDR (2Mbps): -96 dBm • BR (1Mbps): -90 dBm • BLE (2Mbps): -99 dBm • BLE (1Mbps): -97 dBm • BLE Coded PHY (500kbps): -102 dBm • BLE Coded PHY (125kbps): -105 dBm - Active Rx Power: TBD | ||||
Peripherals | 19x configurable I/O: | ||||||
- Serial Flash - SPI - CAN bus (ISO11898) - 12x 12-bit ADC | - SD/MMC - -2x I2C - MIPI-DBI - 2x 12-bit DAC | - SDIO 2.0 - 2x UART - DVP - JTAG | - QSPI - I2S - 4xPWM | ||||
Voltage | - Input voltage: 2.1V~5.5V | - I/O voltage:1.8V/3.3V | |||||
Compliance | - FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC - WEEE, RoHS | - Bluetooth 5.3, OpenThread 1.3, ZigBee Pro 3.0 - Wi-Fi Alliance, Matter, AWS qualified device | |||||
Environmental | - Temperature • Operating: -40°C ~ 10 • Storage: -40°C ~ 85°C |
5°C | - Humidity • Relative: < 90% • Storage: < 90% |
Non-condensing Non-condensing | |||
Physical | - Dimension: 12.28 x 12.28/16.28 x 2.1 mm - Pin: 36 LGA pad | - Weight: TBD - Antenna: Pin or PCB or U.FL | |||||